News Release
OCP-IP Announces Release of OCP 2.0 SpecificationWork Begins on OCP 2.1 with a Focus on Advanced Processor SupportPORTLAND, ORE. — November 17, 2003 — Open Core Protocol International Partnership (OCP-IP), the association providing a common standard for intellectual property core interfaces, or sockets, that facilitate “plug and play” SoC design, today announced availability of the OCP 2.0 specification. The group also announced it has begun work on OCP 2.1 with a focus on advanced processor support for both DSP and embedded applications. OCP 2.0 was approved for release by the OCP Governing Steering Committee (GSC) after an extensive general member review and now includes: a model for write transfers which provides for precise end-to-end-responses, an enhanced burst model that provides for both burst length and packet style transfers, support for specification of endianness, as well as support for user-defined in-band command data and response extensions which can be used to support features such as parity and Error Correcting Codes. The specification also makes provisions for lite-weight OCP interfaces with read only/write only/FIFO style IP cores and support for lazy memory synchronization. OCP-IP believes a standard is only proven through real-world implementations and products. Many OCP-IP members, companies with world-class SoC design expertise in their own right, have adopted OCP and have used it in production SoC designs. OCP 2.0 utilizes the collective experience of many of these SoC designers and EDA providers and directly addresses their enhancement requests with the new specification. Work on OCP 2.0 is executed by members of the OCP-IP Specification Working Group including: Texas Instruments, Nokia, STMicroelectronics, MIPS and other industry leading companies. “The partnership's working groups are extremely active and have done a tremendous job rapidly evolving the specification,” said Ian Mackintosh, president of OCP-IP. “Adoption of OCP has been quite dramatic and we now have a large number of EDA vendors and IP suppliers offering OCP conforming tools and products. We are excited to begin work on OCP 2.1.” Copies of the OCP 2.0 specification and a schedule of OCP 2.0 deliverables and collateral are also available at www.ocpip.org.
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