Press Release
Temento Systems Joins OCP-IP
PORTLAND, ORE. — November 8, 2005 — Open Core Protocol
International Partnership (OCP-IP) announces that Temento Systems has joined
the Organization. Temento Systems S.A. is a provider of Test, Debug and
Verification solutions for FPGA, System On Chip (SoC), Boards and Hardware
Platforms. Leveraging the advantages of OCP, the industry standard socket,
allows Temento to shorten design time and bring products to market more
quickly.
Temento's solutions supports customers who are developing complex FPGA,
boards, and System On a Chip (SOC) components for integration in their
application standard products. They offer the first integrated suite of
products to fully address the test challenges presented by high-complexity,
boards and semiconductor process technologies.
Temento’s products are used in major companies by a diverse set of design
teams including: development, industrialization, manufacturing, and
maintenance groups from various worldwide industrial sectors, including:
semiconductor, telecommunications, consumer electronics, computer,
automotive, and aerospace.Temento plans to use OCP in its DiaLite line of
products. From small FPGA to the largest and most complex designs, DiaLite
is the reference in debugging and verification tools. The adoption of the
OCP standard will extend the possibilities of large design verification,
especially the ones based on SoC.
“Temento is a premiere provider of Test, Debug and Verification solutions
for FPGA, System On Chip (SoC), Boards and Hardware Platforms,” said Ian
Mackintosh, president of OCP-IP. "We are delighted at their adoption and
endorsement of OCP and look forward to working with them in the
future.”
“Temento Systems is pleased to announce its membership in OCP-IP. The
support of international standards, and independence from proprietary
interfaces are key factors in shortening product life cycles and designing
complex SOC and FPGA circuits. We look forward to working with OCP partners
to provide IP debugging tools to facilitate the verification of OCP based
products.” said Patrice Deroux-Dauphin, President and CEO of Temento
Systems.
OCP-IP members receive free training, support, software tools, and
documentation. This infrastructure allows IP and EDA vendors to eliminate
the need to internally design, document, train and evolve a proprietary
standard and set of support tools, which enables these vendors to focus
their efforts and resources on the challenges of developing IP that can be
quickly integrated and easily verified in a wide variety of SoC designs. As
a result, IC design teams can better dedicate their critical resources to
the design and delivery of products.
About Temento Systems
Temento Systems S.A. provides Electronic Design and Test Automation (EDTA)
solutions, that enable to test, and to debug electronic products (System on
Chip (SoC), FPGAs, Boards, Multi-Chips Modules (MCMs), and Systems). Unlike
traditional EDA software providers, Temento Systems offers a broad range of
solutions focused on systems design test, starting from the earliest stage
of design definition (virtual test), straight through hardware testing
(physical test). Temento's solutions are used by product development teams,
manufacturing teams, maintenance teams, in major companies, and SME in the
semi-conductor, telecommunications, consumer electronics, computer,
automotive, and aerospace industries. For more information, visit the
Temento web site at www.temento.com.
About OCP-IP
The OCP International Partnership Association, Inc. (OCP-IP), formed in
2001, promotes and supports the Open Core Protocol (OCP) as the complete
socket standard ensuring rapid creation and integration of interoperable
virtual components. OCP-IP's Governing Steering Committee participants are:
Nokia [NYSE: NOK], Texas Instruments [NYSE: TXN], STMicroelectronics [NYSE:
STM], Toshiba Semiconductor Group (including Toshiba America TAEC), and
Sonics. OCP-IP is a non-profit corporation delivering the first fully
supported, openly licensed, core-centric protocol comprehensively fulfilling
system-level integration requirements. The OCP facilitates IP core
reusability and reduces design time, risk, and manufacturing costs for SoC
designs. VSIA endorses the OCP socket, and OCP-IP is affiliated with the VSI
Alliance.
For additional background and membership information, visit
www.OCPIP.org.
All trademarks product names and logos are property of their respective
owners.
